Midland, Michigan, USA, January 17, 2017 – Dow Corning, a global leader in silicones, silicon-based technology and innovation, today launched a new Three highly reflective silicone coatings further enrich Dow Corning’s rapidly growing portfolio of innovative LED solutions. These three products greatly enhance the design flexibility of LED packaging manufacturers. They are not only suitable for the design of high-end LEDs such as chip-scale packaging (CSP) and chip-on-board packaging (COB), but also provide solutions ranging from traditional dispensing methods to new printing. A variety of processing options for the method.
These three new silicone coatings are WR-3001 mold edge coating, WR-3100 mold edge coating and WR-3120 reflective coating, all of which belong to the DowCorning® brand series. In order to match customers’ diverse process needs, Dow Corning will continue to launch new products.
Takuhiro Tsuchiya, global marketing manager of Dow Corning, said: “Manufacturers are actively exploring smaller, more efficient and cost-effective LED packaging design solutions, so there is a greater need for advanced new reflective materials to facilitate printing. and other evolving application processes, as well as to cope with increasingly stringent operating conditions. The launch of these three new silicone coatings is just the beginning. We will continue to develop a series of new coating products for the industry. Dow Corning has been committed to proactively promoting Through various collaborative innovations, our three reflective silicone coatings can help customers overcome today’s biggest design problems, allowing them to provide highly reliable and differentiated products in the highly competitive LED market.”
Like Dow Corning’s other reflective materials, these three coatings maintain high reflectivity at low thicknesses and maintain their performance at sustained temperatures of 150°C, where many other organic coatings can crack and yellow. . In order of hardness from low to high, these three new products are:
•WR-3001 mold edge coating: has excellent photothermal stability and is specially used for high-power chip size packaging (CSP) ) application, and is suitable for traditional dispensing processes.
•WR-3100 mold edge coating: specially used for chip size packaging (CSP) applications and low and medium power LED packaging design, and suitable for traditional dispensing processes; its cured hardness is as high as 65D and can be used in the chip cutting process.
•WR-3120 reflective coating: WR-3120 is the product with the highest hardness and reflectivity among the three new products, and has high photothermal stability. It is suitable for high-power LED packaging applications and printing processes. Improve LED equipment performance.
Dow Corning is a market leader in LED lighting materials, technology and collaborative innovation. It provides solutions covering the entire LED value chain to help more reliable and efficient encapsulation, protection, adhesion, cooling and Forming LED lamps for all lighting applications.
